================= Mount-first.Ng@ad.umanitoba.ca =====================        /\
Mount-first Ng  :: Information Technologist, EITC, E3-550.        O +-—/~~\
(204)-474-9657  :: Dept. of Electrical and Computer Engineering.   X--/\/\/\
================= University of Manitoba =======================  | \/      \



Begin forwarded message:

From: "Jenna Craig" <mail-comsol-bos@comsol.com>
Subject: Modeling Bonding and Debonding in Adhesive Joints Webinar
Date: November 29, 2017 at 8:37:45 AM CST
To: "Mount-First Ng" <mount-first.ng@umanitoba.ca>
Reply-To: Jenna Craig <jenna@comsol.com>

Hello,

Interested in learning how to model the assembly and failure of adhesive joints?

Then join us today at 2:00 p.m. EST for a live presentation and demo. To register, visit: http://comsol.com/c/6acy.

In this webinar, Mark Oliver from Veryst Engineering will showcase two examples in the COMSOL Multiphysics® software: thermocompression bonding and debonding under load.

You will have the opportunity to interact with the presenter during a Q&A session.

See you at the webinar,

Jenna Craig
COMSOL, Inc. | 100 District Avenue | Burlington, MA 01803 USA
Phone: (781) 273-3322 | Email: jenna@comsol.com

—

This email has been sent to you to advertise a webinar. If you wish to stop receiving product news and event invitations from COMSOL, visit: http://www.comsol.com/unsubscribe.