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From: "Jenna Craig" <mail-comsol-bos@comsol.commailto:mail-comsol-bos@comsol.com> Date: July 21, 2017 at 11:07:56 PM GMT+8 To: "Mount-First Ng" <mtfirst@ad.umanitoba.camailto:mtfirst@ad.umanitoba.ca> Subject: Webinar: Simulation of Thermal Stress in 3D Printing (7/27) Reply-To: Jenna Craig <jenna@comsol.commailto:jenna@comsol.com>
Dear Colleague,
On Thursday, July 27, NASA Tech Briefs and COMSOL will give a free webinar on "Simulation of Thermal Stress in 3D Printing." Details and registration are available below.
Additive manufacturing has achieved great popularity through the use of polymers in prototyping. From there, it has moved on to the use of metal alloys in the manufacturing of production components, where geometric distortion can occur when the heat source melts too far into the deposited layers and generates new thermal stresses. Residual stresses can warp the final geometry, which may have an adverse impact in applications with tight tolerance requirements in high-value manufacturing.
In this webinar, we will show how to use numerical simulation to investigate this phenomenon with the COMSOL Multiphysics(r) software. This includes how to create a customized app that readily allows different teams to perform analyses. Following a live demonstration in the software, you can ask questions during the Q&A session.
Speakers: Borja Lazaro Toralles, Team Leader, Physics Modelling Department, MTC. Valerio Marra, Marketing Director, COMSOL.
Live Presentation - Thursday, July 27, 2017 11:00 a.m. EDT. To register, visit: http://comsol.com/c/5pru.
Best Regards,
Jenna Craig COMSOL, Inc. | 100 District Avenue | Burlington, MA 01803 Phone: 781-273-3322 | Email: jenna@comsol.commailto:jenna@comsol.com
P.S. Unable to attend the live event? Register and you'll receive notification once the recorded version is available. We encourage you to forward this invitation to your friends and colleagues!
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