================= Mount-first.Ng@ad.umanitoba.camailto:Mount-first.Ng@ad.umanitoba.ca ===================== /\ Mount-first Ng :: Information Technologist, EITC, E3-550. O +-—/~~\ (204)-474-9657 :: Dept. of Electrical and Computer Engineering. X--///\ ================= University of Manitoba ======================= | / \

Begin forwarded message:

From: "Jenna Craig" <mail-comsol-bos@comsol.commailto:mail-comsol-bos@comsol.com> Subject: Modeling Bonding and Debonding in Adhesive Joints Webinar Date: November 29, 2017 at 8:37:45 AM CST To: "Mount-First Ng" <mount-first.ng@umanitoba.camailto:mount-first.ng@umanitoba.ca> Reply-To: Jenna Craig <jenna@comsol.commailto:jenna@comsol.com>

Hello,

Interested in learning how to model the assembly and failure of adhesive joints?

Then join us today at 2:00 p.m. EST for a live presentation and demo. To register, visit: http://comsol.com/c/6acy.

In this webinar, Mark Oliver from Veryst Engineering will showcase two examples in the COMSOL Multiphysics® software: thermocompression bonding and debonding under load.

You will have the opportunity to interact with the presenter during a Q&A session.

See you at the webinar,

Jenna Craig COMSOL, Inc. | 100 District Avenue | Burlington, MA 01803 USA Phone: (781) 273-3322 | Email: jenna@comsol.commailto:jenna@comsol.com

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