================= Mount-first.Ng(a)ad.umanitoba.ca<mailto:Mount-first.Ng@ad.umanitoba.ca> ===================== /\
Mount-first Ng :: Information Technologist, EITC, E3-550. O +-—/~~\
(204)-474-9657 :: Dept. of Electrical and Computer Engineering. X--/\/\/\
================= University of Manitoba ======================= | \/ \
Begin forwarded message:
From: "Jenna Craig" <mail-comsol-bos(a)comsol.com<mailto:mail-comsol-bos@comsol.com>>
Subject: Setting Up Simulations with LiveLink™ for Inventor® Webinar
Date: May 22, 2018 at 8:07:19 AM CDT
To: "Mount-First Ng" <mount-first.ng(a)umanitoba.ca<mailto:mount-first.ng@umanitoba.ca>>
Reply-To: Jenna Craig <jenna(a)comsol.com<mailto:jenna@comsol.com>>
Hello,
Join us for a webinar today to learn how to synchronize your CAD designs between the Autodesk® Inventor® software and the COMSOL Multiphysics® software. We will discuss the functionality of the LiveLink™ for Inventor® interface, which connects the two software products. You will be shown how to use the products side by side to incorporate your CAD designs into multiphysics simulations. There will also be a live Q&A session at the end of the webinar.
For further details and registration, please visit: http://comsol.com/c/70nm
Best regards,
Jenna Craig
COMSOL, Inc. | 100 District Avenue | Burlington, MA 01803 USA
Phone: (781) 273-3322 | Email: jenna(a)comsol.com<mailto:jenna@comsol.com>
Autodesk, the Autodesk logo, and Inventor are registered trademarks or trademarks of Autodesk, Inc., and/or its subsidiaries and/or affiliates in the USA and/or other countries.
---
This email has been sent to you to advertise a webinar. If you wish to stop receiving product news and event invitations from COMSOL, visit: http://www.comsol.com/unsubscribe.
================= Mount-first.Ng(a)ad.umanitoba.ca<mailto:Mount-first.Ng@ad.umanitoba.ca> ===================== /\
Mount-first Ng :: Information Technologist, EITC, E3-550. O +-—/~~\
(204)-474-9657 :: Dept. of Electrical and Computer Engineering. X--/\/\/\
================= University of Manitoba ======================= | \/ \
Begin forwarded message:
From: "Cinzia Iacovelli" <mail-comsol-bos(a)comsol.com<mailto:mail-comsol-bos@comsol.com>>
Subject: Numerical Simulation of Microfluidic Devices
Date: May 17, 2018 at 8:54:29 AM CDT
To: "Mount-First Ng" <mount-first.ng(a)umanitoba.ca<mailto:mount-first.ng@umanitoba.ca>>
Reply-To: Cinzia Iacovelli <cinzia(a)comsol.com<mailto:cinzia@comsol.com>>
Hello,
Join us today for a discussion on modeling the many physical aspects of microfluidic devices. You will learn about incorporating fluid-structure interaction, electrical and magnetic fields, capillary filling phenomena, and bubble formation into a variety of applications.
The webinar will feature a live demonstration of optimizing geometries for electrokinetically driven flow systems in the COMSOL Multiphysics® software and conclude with a Q&A session.
For more information and registration details, please visit: http://comsol.com/c/6zo2
We hope you can tune in!
Best regards,
Cinzia Iacovelli
COMSOL, Inc. | 100 District Avenue | Burlington, MA 01803 USA
Phone: (781) 273-3322 | Email: cinzia(a)comsol.com<mailto:cinzia@comsol.com>
—
This email has been sent to you to advertise a webinar. If you wish to stop receiving product news and event invitations from COMSOL, visit: http://www.comsol.com/unsubscribe.
================= Mount-first.Ng(a)ad.umanitoba.ca<mailto:Mount-first.Ng@ad.umanitoba.ca> ===================== /\
Mount-first Ng :: Information Technologist, EITC, E3-550. O +-—/~~\
(204)-474-9657 :: Dept. of Electrical and Computer Engineering. X--/\/\/\
================= University of Manitoba ======================= | \/ \
Begin forwarded message:
From: Linda Dougherty <Dougherty(a)cmc.ca<mailto:Dougherty@cmc.ca>>
Subject: ANSYS Webinar FEA-Mechanical - June 1/18 1:00 pm EDT
Date: May 16, 2018 at 9:24:09 AM CDT
To: "LMS_LICENSES_ANSYS_CS_RESEARCH(a)cmc.ca<mailto:LMS_LICENSES_ANSYS_CS_RESEARCH@cmc.ca>" <LMS_LICENSES_ANSYS_CS_RESEARCH(a)cmc.ca<mailto:LMS_LICENSES_ANSYS_CS_RESEARCH@cmc.ca>>
Good Morning,
ANSYS will be holding a webinar : FEA-Mechanical on Friday June 1/18 at 1:00 pm EDT. This webinar will focus on ANSYS structural simulations capabilities.
Please use the link below to register.
http://www.cmc.ca/NewsAndEvents/Webinars/UpcomingWebinars/ANSYS_FEA_Mechani…
Regards
Linda
Linda Dougherty
Licensing Administrator
CMC Microsystems
Innovation Park
945 Princess Street, B50
Kingston, ON
K7L 3V6
613-530-4787
dougherty(a)cmc.ca<mailto:dougherty@cmc.ca>
The NDN Cloud Design Environment provides researchers with secure, high-performance, remotely accessible EDA resources for design of advanced microsystems and nanotechnologies. Go to www.cmc.ca/ndncloud<http://www.cmc.ca/ndncloud> to start your free trial.
================= Mount-first.Ng(a)ad.umanitoba.ca<mailto:Mount-first.Ng@ad.umanitoba.ca> ===================== /\
Mount-first Ng :: Information Technologist, EITC, E3-550. O +-—/~~\
(204)-474-9657 :: Dept. of Electrical and Computer Engineering. X--/\/\/\
================= University of Manitoba ======================= | \/ \
Begin forwarded message:
From: Linda Dougherty <Dougherty(a)cmc.ca<mailto:Dougherty@cmc.ca>>
Subject: ANSYS HFSS Webinar - Registration
Date: May 9, 2018 at 3:20:05 PM CDT
To: "LMS_LICENSES_ANSYS_CS_RESEARCH(a)cmc.ca<mailto:LMS_LICENSES_ANSYS_CS_RESEARCH@cmc.ca>" <LMS_LICENSES_ANSYS_CS_RESEARCH(a)cmc.ca<mailto:LMS_LICENSES_ANSYS_CS_RESEARCH@cmc.ca>>
Good Afternoon
ANSYS will be holding a webinar : An Introduction to HFSS Electronics Desktop on Wednesday May 16th. Please use the link below to register.
https://www.cmc.ca/~/media/NewsAndEvents/Webinars/HFSS_ElectronicsDesktopWe…
Regards
Linda
Linda Dougherty
Licensing Administrator
CMC Microsystems
Innovation Park
945 Princess Street, B50
Kingston, ON
K7L 3V6
613-530-4787
dougherty(a)cmc.ca<mailto:dougherty@cmc.ca>
The NDN Cloud Design Environment provides researchers with secure, high-performance, remotely accessible EDA resources for design of advanced microsystems and nanotechnologies. Go to www.cmc.ca/ndncloud<http://www.cmc.ca/ndncloud> to start your free trial.
================= Mount-first.Ng(a)ad.umanitoba.ca<mailto:Mount-first.Ng@ad.umanitoba.ca> ===================== /\
Mount-first Ng :: Information Technologist, EITC, E3-550. O +-—/~~\
(204)-474-9657 :: Dept. of Electrical and Computer Engineering. X--/\/\/\
================= University of Manitoba ======================= | \/ \
Begin forwarded message:
From: Linda Dougherty <Dougherty(a)cmc.ca<mailto:Dougherty@cmc.ca>>
Subject: COMSOL Webinar Series list and registration : Pre-registration!
Date: May 9, 2018 at 3:00:31 PM CDT
To: "LMS_LICENSES_COMSOL(a)cmc.ca<mailto:LMS_LICENSES_COMSOL@cmc.ca>" <LMS_LICENSES_COMSOL(a)cmc.ca<mailto:LMS_LICENSES_COMSOL@cmc.ca>>
Good Afternoon
COMSOL is running a series of Mini courses. The next one is on May 17, 2018. Pre-register now!
Please use the link below to review and register. https://www.cmc.ca/NewsAndEvents/Webinars/UpcomingWebinars/ComsolMiniCourse…
Regards
Linda
Linda Dougherty
Licensing Administrator
CMC Microsystems
Innovation Park
945 Princess Street, B50
Kingston, ON
K7L 3V6
613-530-4787
dougherty(a)cmc.ca<mailto:dougherty@cmc.ca>
The NDN Cloud Design Environment provides researchers with secure, high-performance, remotely accessible EDA resources for design of advanced microsystems and nanotechnologies. Go to www.cmc.ca/ndncloud<http://www.cmc.ca/ndncloud> to start your free trial.
Sent from my iPad
Begin forwarded message:
From: Altium <webform(a)altium.com<mailto:webform@altium.com>>
Date: May 8, 2018 at 10:40:06 AM CDT
To: mount-first.ng(a)umanitoba.ca<mailto:mount-first.ng@umanitoba.ca>
Subject: Webinar: Introduction to PDN Analyzer™
Reply-To: <webform(a)altium.com<mailto:webform@altium.com>>
Introduction to PDN Analyzer™
To view this email as a web page, click here<http://pages.altium.com/v/TcySn040f001kFE30zq4qW0>
[Altium Designer]<http://pages.altium.com/dc/rWMVCaVviY_wnEb5TmHIPBxFfGoUawfTi-_UD9wBj_RBpkHz…>
LIVE WEBINAR
Visual Power Analysis with PDN Analyzer™
Hi Mount-First,
Whether you’re designing a 22-layer telco backplane, or an LED light bulb, predicting reliable power delivery should not be a guessing game. And analyzing your power delivery network should not be a tedious and isolated process.
Within Altium Designer, PDN Analyzer™ enables you to easily identify and resolve multi-network DC voltage and current density issues - without ever interrupting your design workflow.
May 10, 2018
11AM PDT / 2PM EDT
(PT/ET)
Register<http://pages.altium.com/dc/rWMVCaVviY_wnEb5TmHIPBxFfGoUawfTi-_UD9wBj_RBpkHz…>
Forward to Friend<http://pages.altium.com/v/JF3zS40OfW0ymnk1q4000q0>
Please join this free live webinar and demo to explore:
* The common root causes of power delivery network design issues, and why they occur.
* How PDN Analyzer provides a visual overlay of superimposed return paths to help prevent ground-bounce.
* How to use PDN Analyzer to rapidly cross-probe and resolve current density and voltage drop problems before you prototype.
* How PDN Analyzer enables you to easily capture, record and communicate simulation results.
Contact the team
Our dedicated team is here to help you. You can reach us anytime by phone at 760 231 0760 or email us at sales.na(a)altium.com<http://pages.altium.com/dc/jAX3c9iZq7FvO9SrGv8vgyrJb0YPQODrHtviD3ERiFc=/JF3…> and a team member will get back to you right away.
Many Thanks,
Your Altium Team
[http://go.altium.com/rs/817-SFW-071/images/Banner_Emails_PDN_Release.png]<http://pages.altium.com/FfkFz00Fd1S043n4000Wqyq>
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Altium LLC, 4225 Executive Square, Suite 700, La Jolla, California 92037, United States. Copyright 2018, Altium LLC, all rights reserved. Altium®, ACTIVEBOM®, ActiveRoute®, Altium Designer®, Altium NEXUS™, Altium Vault®, Autotrax®, Camtastic®, Ciiva™, CIIVA SMARTPARTS®, CircuitMaker®, CircuitStudio®, Codemaker™, Common Parts Library™, Draftsman®, DXP™, Easytrax®, LiveDesign®, NanoBoard®, NATIVE 3D™, NEXUS™, Octomyze®, Octopart®, PCBWORKS®, P-CAD®, PDN Analyzer™, Protel®, Situs®, TASKING®, XSIGNALS™, X2™ and their respective logos are trademarks or registered trademarks of Altium LLC or its subsidiaries. All other registered or unregistered trademarks referenced herein are the property of their respective owners and no trademark rights to the same are claimed.
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================= Mount-first.Ng(a)ad.umanitoba.ca<mailto:Mount-first.Ng@ad.umanitoba.ca> ===================== /\
Mount-first Ng :: Information Technologist, EITC, E3-550. O +-—/~~\
(204)-474-9657 :: Dept. of Electrical and Computer Engineering. X--/\/\/\
================= University of Manitoba ======================= | \/ \
Begin forwarded message:
From: "Jenna Craig" <mail-comsol-bos(a)comsol.com<mailto:mail-comsol-bos@comsol.com>>
Subject: Hydration and Thermal Stress Modeling in Mass Concrete
Date: May 3, 2018 at 8:20:47 AM CDT
To: "Mount-First Ng" <mtfirst(a)ad.umanitoba.ca<mailto:mtfirst@ad.umanitoba.ca>>
Reply-To: Jenna Craig <jenna(a)comsol.com<mailto:jenna@comsol.com>>
Hello,
Are you looking to accurately predict thermal stresses that result from cement hydration? If so, join us for a webinar today to learn how to model thermal cracking in mass concrete. We will discuss obtaining temperature distributions, computing stresses and mechanical loads, and using equation-based modeling features in the COMSOL Multiphysics® software. The webinar will also feature a live demo in the software and a Q&A session.
For registration and further details, please visit: http://comsol.com/c/6y2k
We look forward to you tuning in!
Best regards,
Jenna Craig
COMSOL, Inc. | 100 District Avenue | Burlington, MA 01803 USA
Phone: (781) 273-3322 | Email: jenna(a)comsol.com<mailto:jenna@comsol.com>
—
This email has been sent to you to advertise a webinar. If you wish to stop receiving product news and event invitations from COMSOL, visit: http://www.comsol.com/unsubscribe.